Zen 2

Zen 2 is the codename for a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, fabricated on the 7 nanometer MOSFET node from TSMC and powering the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips and Threadripper 3000 for high-end desktop systems[3][4], and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on July 7, 2019,[5][6] while the Zen 2-based Epyc server CPUs (codename "Rome") were released on August 7, 2019.[7] An additional Ryzen 9 3950X was released in November 2019.[5] At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads.[3] AMD CEO Lisa Su also said to expect more than eight cores in the final lineup.[8] At Computex 2019, AMD revealed that the Zen 2 "Matisse" processors would feature up to 12 cores, and a few weeks later a 16 core processor was also revealed at E3 2019, being the aforementioned Ryzen 9 3950X.[9][10]

AMD Zen 2
General Info
LaunchedJuly 2019
Designed byAMD
Common manufacturer(s)
  • TSMC (core die)
  • Global Foundries (I/O die)
Cache
L1 cache64 KiB per core
L2 cache512 KiB per core
Architecture and classification
Min. feature size7 nm (TSMC)[1][2]
Physical specifications
Cores
  • up to 64
Socket(s)
Products, models, variants
Product code name(s)
  • Matisse (Desktop)
  • Rome (Server)[2]
  • Castle Peak (HEDT)
History
PredecessorZen+
SuccessorZen 3

Zen 2 includes hardware mitigations to the Spectre security vulnerability.[11] Zen 2-based EPYC server CPUs use a design in which multiple CPU dies (up to eight in total) manufactured on a 7 nm process ("chiplets") are combined with a 14 nm I/O die on each multi-chip module (MCM) package. Using this, up to 64 physical cores and 128 total compute threads (with simultaneous multithreading) are supported per socket. This architecture is nearly identical to the layout of the "pro-consumer" flagship processor Threadripper 3990X.[12] Zen 2 delivers about 15% more instructions per clock than Zen and Zen+, the 14 and 12nm microarchitectures utilized on 1st and 2nd generation Ryzen respectively.

Design
Two delidded Zen 2 processors designed with the multi-chip module approach. The CPU on the left (used for mainstream Ryzen CPUs) uses a smaller, less capable I/O die and up to two CCDs (only one is used on this particular example), while the one on the right (used for HEDT (High End DeskTop) Ryzen Threadripper and server Epyc CPUs) uses a larger, more capable I/O die and up to eight CCDs.
Mainstream Ryzen I/O Die, removed from CPU package
EPYC I/O Die
CCD removed from CPU package

Zen 2 is a significant departure from the physical design paradigm of AMD's previous Zen architectures, Zen and Zen+. Zen 2 moves to a multi-chip module design where the I/O components of the CPU are laid out on its own, separate die, which is also called a chiplet in this context. This separation has benefits in scalability and manufacturability. As physical interfaces don't scale very well with shrinks in process technology, their separation into a different die allows these components to be manufactured using a larger, more mature process node than the CPU dies. The CPU dies (referred to by AMD as Core Complex Dies or CCDs), now more compact due to the move of I/O components onto another die, can be manufactured using a smaller process with fewer manufacturing defects than a larger die would exhibit (since the number of defects is proportional to device (die) size) while also allowing for more dies per wafer. In addition, the central I/O die can service multiple chiplets, making it easier to construct processors with a large number of cores.[13][14][15]

Simplified illustration of the Zen 2 microarchitecture

With Zen 2, each CPU chiplet houses 8 cores, arranged in two core complexes (CCX) of 4 cores each. These chiplets are manufactured using TSMC's 7 nanometer MOSFET node and are about 74 to 80 mm2 in size.[14] The chiplet has about 3.9 billion transistors, while the 12 nm IOD (I/O Die) is ~125 mm2 and has 2.09 billion transistors. The amount of L3 cache has been doubled to 32 MiB, with each core on an 8-core chiplet now having access to 4 MiB of L3 compared to the 2 MiB of Zen and Zen+.[16] AVX2 performance is greatly improved by an increase in execution unit width from 128-bit to 256-bit.[17]

There are multiple variants of the I/O die: one manufactured on GlobalFoundries 14 nanometer process, and another manufactured using the same company's 12 nanometer process. The 14 nanometer dies have more features and are used for the EPYC Rome processors, whereas the 12 nm versions are used for consumer processors.[14]

AMD's Zen 2 architecture can deliver higher performance at a lower power consumption than Intel's Cascade Lake architecture, with an example being the AMD Ryzen Threadripper 3970X running with a TDP of 140W in ECO mode delivering higher performance than the Intel Core i9-10980XE running with a TDP of 165W.[18]

New features
  • Some new instruction set extensions: WBNOINVD, CLWB, RDPID, RDPRU, MCOMMIT. Each instruction uses its own CPUID bit.[19][20]
  • Hardware mitigations against the Spectre V4 speculative store bypass vulnerability.[21]

Feature tables

CPUs

CPU features table

APUs

APU features table

Products

On May 26, 2019, AMD announced six Zen 2-based desktop Ryzen processors (codenamed "Matisse"). These included 6-core and 8-core variants in the Ryzen 5 and Ryzen 7 product lines, as well as a new Ryzen 9 line that includes the company's first 12-core and 16-core mainstream desktop processors.[22]

AMD's 2nd generation of Epyc processors, codenamed "Rome", features up to 64 cores and was launched on August 7, 2019.[7]

Desktop CPUs
Model Release date
and price		 Process Cores/FPUs
(threads)		 Clock rate (GHz) Cache[lower-alpha 1] Socket PCIe
lanes		 Memory
support		 TDP Stock cooler (box)[lower-alpha 2]
Base Boost L1 L2 L3
Entry-level
Ryzen 3 3100[24] April 21, 2020
$99		 TSMC
7FF		 4 (8) 3.6 3.9 32 KB inst.
32 KB data
per core		 512 KB
per core		 16 MiB AM4 24 DDR4-3200
dual-channel		 65 W Wraith Stealth
Ryzen 3 3300X[25] April 21, 2020
$120		 3.8 4.3
Mainstream
Ryzen 5 3500 November 15, 2019
OEM (West)
Japan ¥16000[26]		 TSMC
7FF		 6 (6) 3.6 4.1 32 KB inst.
32 KB data
per core		 512 KB
per core		 16 MiB AM4 24 DDR4-3200
dual-channel		 65 W Wraith Spire
Ryzen 5 3500X[27] October 8, 2019
China ¥1099		 32 MiB Wraith Stealth
Ryzen 5 3600[28] July 7, 2019
US $199		 6 (12) 3.6 4.2
Ryzen 5 Pro 3600[29] September 30, 2019
OEM		 N/A
Ryzen 5 3600X[30] July 7, 2019
US $249		 3.8 4.4 95 W Wraith Spire v2
Ryzen 5 3600XT[31] July 7, 2020
US $249		 4.5
Performance
Ryzen 7 Pro 3700[32] September 30, 2019
OEM		 TSMC
7FF		 8 (16) 3.6 4.4 32 KB inst.
32 KB data
per core		 512 KB
per core		 32 MiB AM4 24 DDR4-3200
dual-channel		 65 W[lower-alpha 3] N/A
Ryzen 7 3700X[34] July 7, 2019
US $329		 Wraith Prism
Ryzen 7 3800X[35] July 7, 2019
US $399		 3.9 4.5 105 W
Ryzen 7 3800XT[36] July 7, 2020
US $399		 4.7 N/A
Enthusiast
Ryzen 9 3900[37] October 8, 2019
OEM		 TSMC
7FF		 12 (24) 3.1 4.3 32 KB inst.
32 KB data
per core		 512 KB
per core		 64 MiB AM4 24 DDR4-3200
dual-channel		 65 W N/A
Ryzen 9 Pro 3900[38] September 30, 2019
OEM
Ryzen 9 3900X[39] July 7, 2019
US $499		 3.8 4.6 105 W[lower-alpha 4] Wraith Prism
Ryzen 9 3900XT[40] July 7, 2020
US $499		 4.7 N/A
Ryzen 9 3950X[41] November 25, 2019
US $749		 16 (32) 3.5 N/A
High End Desktop
Ryzen Threadripper 3960X[42] November 25, 2019
US $1399		 TSMC
7FF		 24 (48) 3.8 4.5 32 KB inst.
32 KB data
per core		 512 KB
per core		 128 MiB sTRX4 64 DDR4-3200
quad-channel		 280 W[lower-alpha 5] N/A
Ryzen Threadripper 3970X[44] November 25, 2019
US $1999		 32 (64) 3.7 4.5
Ryzen Threadripper 3990X[45] February 7, 2020
US $3990		 64 (128) 2.9 4.3 256 MiB
Workstation
Ryzen Threadripper Pro 3945WX[46] July 14, 2020
OEM		 TSMC
7FF		 12 (24) 4.0 4.4 32 KB inst.
32 KB data
per core		 512 KB
per core		 64 MiB sWRX8 128 DDR4-3200
octa-channel		 280 W N/A
Ryzen Threadripper Pro 3955WX[47] July 14, 2020
OEM		 16 (32) 3.9
Ryzen Threadripper Pro 3975WX[48] July 14, 2020
OEM		 32 (64) 3.5 4.35 128 MiB
Ryzen Threadripper Pro 3995WX[49] July 14, 2020
OEM		 64 (128) 2.7 4.3 256 MiB
  1. AMD in its technical documentation uses "KB", which it defines as "Kilobyte" and as equal to 1024 bytes (1 KiB), and "MB", which it defines as "Megabyte" and as equal to 1024 "KB" (1 MiB).[23]
  2. A box without cooler might also be available (WOF).
  3. Ryzen 7 3700X may consume over 90 W under load.[33]
  4. Ryzen 9 3900X and Ryzen 9 3950X may consume over 145 W under load.[33]
  5. Ryzen Threadripper 3990X may consume over 490 W under load.[43]

Desktop APUs
Model Release Date
& Price		 Fab CPU GPU Memory
support		 TDP
Cores
(threads)		 Clock rate (GHz) Cache[lower-alpha 1] Model Config[lower-alpha 2] Clock Processing
power
(GFLOPS)[lower-alpha 3]
Base Boost L1 L2 L3
Ryzen 3 4300GE [51] 2H 2020 [52] TSMC
7FF		 4 (8) 3.5 4.0 32 KB inst.
32 KB data
per core		 512 KB
per core		 8 MB 7nm Vega 6 384:24:8
6 CU		 1700 MHz 1305.6 DDR4-3200
dual-channel		 35 W
Ryzen 3 Pro 4350GE[51]
Ryzen 3 4300G[51] 3.8 4.0 65 W
Ryzen 3 Pro 4350G[51]
Ryzen 5 4600GE[51] 6 (12) 3.3 4.2 7nm Vega 7 448:28:8
7 CU		 1900 MHz 1702.4 35 W
Ryzen 5 Pro 4650GE[51]
Ryzen 5 4600G[51] 3.7 4.2 65 W
Ryzen 5 Pro 4650G[51]
Ryzen 7 4700GE[51] 8 (16) 3.1 4.3 7nm Vega 8 512:32:8
8 CU		 2000 MHz 2048 35 W
Ryzen 7 Pro 4750GE[51]
Ryzen 7 4700G[51] 3.6 4.4 2100 MHz 2150.4 65 W
Ryzen 7 Pro 4750G[51]
  1. AMD defines 1 kilobyte (KB) as 1024 bytes, and 1 megabyte (MB) as 1024 kilobytes.[50]
  2. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. Single-precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Mobile Processors
Model Release
date		 Process CPU GPU Memory support TDP Part number
Cores
(threads)		 Clock rate (GHz) Cache[lower-alpha 1] Model &
config[lower-alpha 2]		 Clock Processing
power
(GFLOPS)[lower-alpha 3]
Base Boost L1 L2 L3
Ryzen 3 4300U[53] March 16, 2020 TSMC
7FF		 4 (4) 2.7 3.7 32 KB inst.
32 KB data
per core		 512 KB
per core		 4 MB 7nm Vega 5
320:20:8
5 CU		 1400 MHz 896 DDR4-3200

LPDDR4-4266

dual-channel

 10-25W 100-000000085
Ryzen 3 Pro 4450U[54] May 7, 2020 4 (8) 2.5 100-000000104
Ryzen 5 4500U[55] March 16, 2020 6 (6) 2.3 4.0 8 MB 7nm Vega 6
384:24:8
6 CU		 1500 MHz 1152 100-000000084
Ryzen 5 4600U[56] 6 (12) 2.1 100-000000105
Ryzen 5 Pro 4650U[57] May 7, 2020 100-000000103
Ryzen 5 4600HS[58] March 16, 2020 3.0 35 W
Ryzen 5 4600H[59] 35-54 W 100-000000100
Ryzen 7 4700U[60] 8 (8) 2.0 4.1 7nm Vega 7
448:28:8
7 CU		 1600 MHz 1433.6 10-25 W 100-000000083
Ryzen 7 Pro 4750U[61] May 7, 2020 8 (16) 1.7 100-000000101
Ryzen 7 4800U[62] March 16, 2020 1.8 4.2 7nm Vega 8
512:32:8
8 CU		 1750 MHz 1792 100-000000082
Ryzen 7 4800HS[63] 2.9 7nm Vega 7
448:28:8
7 CU		 1600 MHz 1433.6 35 W
Ryzen 7 4800H[64] 35-54 W 100-000000098
Ryzen 9 4900HS[65] 3 4.3 7nm Vega 8
512:32:8
8 CU		 1750 MHz 1792 35 W
Ryzen 9 4900H[66] 3.3 4.4 35-54W
  1. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.
  2. Unified Shaders : Texture Mapping Units : Render Output Units and Compute Units (CU)
  3. Single precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.

Server processors

Codenamed "Rome". Common features of these CPUs:

  • Codenamed "Rome"
  • The number of PCI-E lanes: 128
  • Socket: SP3
  • Release date: August 7, 2019 except EPYC 7H12 which was released on September 18, 2019
  • Memory support: eight-channel DDR4-3200
Model Fab Socket
configu-
ration		 Cores/FPUs
(threads)		 Clock rate (GHz) Cache[lower-alpha 1] TDP Release
price
(USD)
Base Boost L1
(KB)		 L2
(KB)		 L3
(MB)
All-core Max
EPYC 7232P 7nm 1P 8 (16) 3.1 3.2 32 KB inst.
32 KB data
per core		 512 KB
per core		 32 120 W $450
EPYC 7302P 16 (32) 3 3.3 128 155 W $825
EPYC 7402P 24 (48) 2.8 3.35 180 W $1250
EPYC 7502P 32 (64) 2.5 3.35 $2300
EPYC 7702P 64 (128) 2 3.35 256 200 W $4425
EPYC 7252 2P 8 (16) 3.1 3.2 64 120 W $475
EPYC 7262 3.2 3.4 128 155 W $575
EPYC 7272 12 (24) 2.9 3.2 64 120 W $625
EPYC 7282 16 (32) 2.8 3.2 $650
EPYC 7302 3 3.3 128 155 W $978
EPYC 7352 24 (48) 2.3 3.2 $1350
EPYC 7402 2.8 3.35 180 W $1783
EPYC 7452 32 (64) 2.35 3.35 155 W $2025
EPYC 7502 2.5 3.35 180 W $2600
EPYC 7532 2.4 3.3 256 200 W $3350
EPYC 7542 2.9 3.4 128 225 W $3400
EPYC 7552 48 (96) 2.2 3.3 192 200 W $4025
EPYC 7642 2.3 3.3 256 225 W $4775
EPYC 7662 64 (128) 2 3.3 225 W $6150
EPYC 7702 2 3.35 200 W $6450
EPYC 7742 2.25 3.4 225 W $6950
EPYC 7H12 2.6 3.3 280 W
EPYC 7F32 1P/2P 8 (16) 3.7 3.9 128 180 W $2100
EPYC 7F52 16 (32) 3.5 3.9 256 240 W $3100
EPYC 7F72 24 (48) 3.2 3.7 192 240 W $2450
  1. AMD in its technical documentation uses KB, which it defines as Kilobyte and as equal to 1024 bytes, and MB, which it defines as Megabyte and as equal to 1024 KB.[23]

Video game consoles
gollark: Yes.
gollark: > Rust
gollark: Mostly people just make dark sorcery/subframe electronics in it to do computation.
gollark: Just design a new calendar system with, let's say, 28 months with different lengths.
gollark: Dates are a social convention. We can define a better pi day into existence.

See also

References
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  2. Cutress, Ian (20 June 2017). "AMD EPYC Launch Event Live Blog". AnandTech. Retrieved 21 June 2017.
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  4. online, heise. "AMD Ryzen 3000: 12-Kernprozessoren für den Mainstream". c't Magazin.
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  13. Shilov, Anton (6 November 2018). "AMD Unveils 'Chiplet' Design Approach: 7nm Zen 2 Cores Meet 14 nm I/O Die". AnandTech. Retrieved 17 June 2019.
  14. Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. p. 1. Retrieved 17 June 2019.
  15. De Gelas, Johan (7 August 2019). "AMD Rome Second Generation EPYC Review: 2x 64-core Benchmarked". AnandTech. Retrieved 29 September 2019.
  16. Cutress, Ian (10 June 2019). "AMD Zen 2 Microarchitecture Analysis: Ryzen 3000 and EPYC Rome". AnandTech. Retrieved 17 June 2019.
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  18. "AMD Ryzen Threadripper 3970X Is An Absolutely Efficient Monster CPU".
  19. "AMD Zen 2 CPUs Come With A Few New Instructions - At Least WBNOINVD, CLWB, RDPID - Phoronix".
  20. "GNU Binutils Adds Bits For AMD Zen 2's RDPRU + MCOMMIT Instructions - Phoronix". www.phoronix.com.
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