Sony ILCE-QX1

The Sony ILCE-QX1[1][2] is a mobile device mountable, Wi-Fi-controlled, lens-type compact camera manufactured by Sony and was announced on 3 September 2014. Part of the Sony α family, it is one of Sony's "Smart Lens" cameras, alongside the QX10, QX30 and QX100, that are designed to be specifically used with a smartphone. It has a 20.1 megapixel APS-C-size sensor, uses an interchangeable E-mount lens as its highlight feature, supports power zoom but no in-body image stabilization, and has a pop-up flash unlike its other QX siblings.[3]

Sony ILCE-QX1
Sony Alpha ILCE-QX1
Overview
MakerSony
Lens
Lens mountSony E-mount
Sensor/medium
Image sensor typeCMOS
Image sensor size23.2 × 15.4 mm (APS-C type)
Maximum resolution5456 × 3632 (20 megapixels)
ASA/ISO range100-16000
Recording mediumOne microSD, microSDHC, microSDXC, or MemoryStick Micro card
Focusing
Focus areas25 focus points
Shutter
Shutter speeds1/4000 s to 30 s
Continuous shooting3.5 frames per second in speed priority mode, 2.5 fps in standard continuous mode
Image processing
Image processorBionz X
Custom WBNo
General
Dimensions74 × 70 × 53 mm (2.91 × 2.76 × 2.09 inches)
Weight216 g including battery

Features

Sony ILCE-QX1 with flash extended.

On the ILCE-QX1 itself, there are buttons for on/off, flash pop-up, lens release and shutter, which are enough for standalone shooting.[4] But due to its lens-style design, the camera module requires an iOS or Android device, connected through the camera's Wi-Fi via the Imaging Edge (formerly PlayMemories) Mobile application, to utilize the device's screen as its viewfinder and camera controls, while also serving as additional storage medium via its integrated wireless file transfer feature.[5]

The ILCE-QX1 allows capture in RAW format, but RAW files can only be directly wirelessly transferred to Android devices, not, as of September 2014, to iOS.[5]Video capture is possible in Full HD at 30 fps,[3] and battery life for still capture is rated at 440 shots.[6]

gollark: Moore's law stopped being accurate a few years ago.
gollark: More so than with existing chips and chiplet designs, because you have even more heat in the same area.
gollark: And you still run into the issues of power and heat.
gollark: Right now, stuff just uses interconnected stacked dies. Transistors being stacked within *one* die might be neat, but it hasn't happened yet.
gollark: Those are entirely different things.

See also

References

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