Prokon

PROKON Structural Analysis and Design is a suite of commercial software for structural analysis and design. PROKON software is produced by South African company Prokon Software Consultant (Pty) Ltd. The company was founded by Karl Eschberger and Jacques Pienaar in 1989.[1]

PROKON Structural Analysis and Design
Developer(s)Prokon Software Consultant (Pty) Ltd.
Initial release1989
Stable release
3.1 / October 1, 2018 (2018-10-01)
Operating systemWindows
Available inEnglish
TypeStructural Analysis
LicenseProprietary
Websiteprokon.com

Name

The Prokon company and PROKON software name is an acronym for the Afrikaans phrase "PROgrammatuur KONsultante" (programming consultants).

Overview

PROKON software comprises over 40 modules in the following categories:

The software includes full support for British, European and South African design codes, with some modules also supporting North American, Australian, New Zealand, and selected Asian design codes.[6] PROKON appears on the Hong Kong Building Department list of pre-accepted computer programs for use in Hong Kong.[7]

Workflow

PROKON uses a workflow that output data between analysis, design and detailing modules. It supports data exchange formats with third-party software: DXF and DWG drawings, and CIS/2 CIMsteel[8] three-dimensional structural models. The Prodesk module enables data exchange between Autodesk Revit and PROKON.

Use

PROKON is used widely in South Africa.[9]

Similar Software

References

  1. "Prokon company history". Product website.
  2. "Sumo Structural Modeller tutorials". YouTube.
  3. "Example use of PROKON Base Plate Design module". StrucVille.
  4. "Prokon 2.6 tutorials". YouTube. Retrieved 10 April 2015.
  5. "Example use of PROKON Pile Design module". StrucVille.
  6. "PROKON 3.1 Supported Design Codes". Product website.
  7. "HKBD Pre-Accepted Structural Programs" (PDF). Hong Kong Building Department.
  8. "CIS/2 interaction with Tekla Structures". Tekla Structures Science and Technology Forum.
  9. "2008/09 NSTF awards" (PDF). National Science and Technology Forum. p. 14.
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