Mukta Farooq

Mukta Ghate Farooq is a metallurgical engineer working for the IBM Corporation in Hopewell Junction, New York. She was named a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) in 2016[1] for her contributions to 3D integration and interconnect technology. She currently works at GlobalFoundries and has over 200 issued patents including patent numbers 10199315, 20180061749, and 8367543.[2][3] In 2017, IIT Bombay awarded her the notable alumna award [4]

Mukta Farooq
Alma mater

Education

Farooq received her B.Tech degree from [| IIT Bombay]. Farooq got her master's degree from Northwestern University in Materials Science and got her Ph.D. in Materials Science from Rensselaer Polytechnic Institute.[5]

References
  1. "2016 elevated fellow" (PDF). IEEE Fellows Directory.
  2. US Patents of Mukta Farooq
  3. "Mukta Ghate Farooq Inventions, Patents and Patent Applications - Justia Patents Search". patents.justia.com. Retrieved 2019-03-30.
  4. https://skilloutlook.com/education/iit-bombay-58th-foundation-day-honours-11-distinguished-alumnus-awards-2-young-alumnus-achievers-awards
  5. "Dr. Mukta Ghate Farooq | Alumni and Corporate Relations". www.iitb.ac.in. Retrieved 2019-03-30.

[1][2]


  1. Farooq, M. G.; Graves-Abe, T. L.; Landers, W. F.; Kothandaraman, C.; Himmel, B. A.; Andry, P. S.; Tsang, C. K.; Sprogis, E.; Volant, R. P. (December 2011). "3D copper TSV integration, testing and reliability". 2011 International Electron Devices Meeting: 7.1.1–7.1.4. doi:10.1109/IEDM.2011.6131504. ISBN 978-1-4577-0505-2.
  2. Farooq, Mukta G.; Iyer, Subramanian S. (2011-05-05). "3D integration review". Science China Information Sciences. 54 (5): 1012. doi:10.1007/s11432-011-4226-7. ISSN 1869-1919.
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