LGA 3647

LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing")[2], Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, Skylake-SP and Cascade Lake-W microprocessors.[3]

LGA 3647
TypeLGA
Chip form factorsFlip-chip land grid array (FCLGA)
Contacts3647
FSB protocol
Processor dimensions76.0 mm × 56.5 mm
Processors
Predecessor
Memory supportDDR4

This article is part of the CPU socket series

The socket supports a 6-channel memory controller, non-volatile 3D XPoint memory DIMMs, Intel Ultra Path Interconnect (UPI), as a replacement for QPI, and 100G Omni-Path interconnect.

Variants

There are two sub-versions of this socket with differences in the ILM (Independent Loading Mechanism), and the processor package carrier frame (square, and narrow) preventing mounting the other version's heatsink. Noctua heatsinks designed for this socket come with both square and narrow carrier frames.[4]

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References

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