Hot air solder leveling
HASL or hot air solder leveling is a type of finish used on printed circuit boards (PCBs).
The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.
Advantages of HASL
- Excellent wetting during component soldering
- Avoids copper corrosion.
Disadvantages of HASL
- Low planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components. Improved planarity can be achieved using a horizontal leveler.
- High thermal stress during process may introduce defects into PCB
gollark: I looked.
gollark: I guess *hatchlings* or lower-time eggs would be in demand, but... random new releases?
gollark: If people want them they can just go to the cave.
gollark: You know, with TJ09 meddling a dragon *could* become its own parent...
gollark: It looked like you'd somehow created a loop before I reread it.
See also
This article is issued from Wikipedia. The text is licensed under Creative Commons - Attribution - Sharealike. Additional terms may apply for the media files.