Introduction
Tools
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Switch off your phone.
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Prepare an iOpener for softening the adhesive on the back of the Note8.
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Apply the iOpener on the back of the Note8 along the side with the power button.
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Use a suction handle to lift the back cover and create an opening pick to get in the gap.
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Start at the middle of the side and cut the adhesive while pulling up with the suction handle.
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Move the pick towards the bottom corner and leave it there to keep the adhesive from resealing to the case.
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Use another pick and move it to the top corner.
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Again take another opening pick and carefully move it around the corner and along the top edge.
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Reheat with an iOpener if necessary.
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Leave the pick at the top right corner to keep the adhesive from resealing.
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Rotate the device and start to separate the adhesive at the bottom with another opening pick.
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Leave the pick at the bottom right corner to keep the adhesive from resealing.
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When the adhesive has been separated on all three sides properly you will be able to slowly lift the back cover.
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Pay attention to the fingerprint sensor connector when flipping the back cover open. You might need to disconnect it as described in the next step.
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Use an opening pick at the top edge to get between the NFC antenna and charging coil assembly and the case.
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Lever the top of the assembly out of the case.
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To reassemble your device, follow these instructions in reverse order.
I used a heat gun to soften the glue - worked it around the edges, moving the heat gun quickly. As this is my first attempt, I’m still calibrating on this - but other guides mention getting the back cover hot enough so as it’s just too hot to touch. I also have a temp probe on my multi-meter, and I measured appx. 75 deg. C.
One of the other guides showed using a electronics hot plate set to 105 deg C for 60 sec.
Phil Brooks -