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Check the state of the motherboard. Both the power integrated circuit (IC) and camera IC have been soldered before.
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Install the motherboard to test it. Connect the display and the power cable. The motherboard shows a current leakage of 52 mA.
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Press the power button. Here, the reading has not changed. Therefore, the main power supply line of the motherboard may be faulty.
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Measure several power supply lines of the motherboard using the multimeter's diode mode. Inductor L5039 is shorted to the ground.
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Open the schematic. It shows that L5039 is directly connected both to the main power supply line VBAT, and to the power IC U8031.
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Since power IC U8031 has been soldered previously, we need to verify if it is faulty as a result.
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Attach the motherboard to the holder, applying some paste flux to the power IC.
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Heat with a hot air gun set at 340°C and airflow 3 to remove the IC.
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Clean the bonding pad with solder wick.
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Measure the inductor L5039 using the multimeter's diode mode.
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Clean the bonding pad with PCB cleaner and apply some paste flux.
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Align the new IC. Solder it with a hot air gun set to 340°C and airflow 2. Once the motherboard has cooled, connect the power cable.
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Trigger the boot-up with tweezers. The boot current returns to normal.
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Install the motherboard. The phone turns on normally. The fault has been cleared.
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To reassemble your device, follow these instructions in reverse order.
One comment
sir. in step 4. i remove IC U8031 and Clean the bonding pad with Solder Wick.but when i Measure the inductor L5039 with diode mode of the multimeter. The diode value is shorted to the ground. How i fix it? thank i’m from Thailand
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